High Thermal Conductivity Film (HTCF)
Semiconductor heat-dissipation products.
Specifications
| Code | HCL0301001 |
|---|---|
| Model | 1. HTCF-ACS 2. HTCF-NIS 3. HTCF-ACP |
| Family | Material Products |
Highlights
Thermal management and protection of the exposed silicon (Si) backside in packaging Thermal interface materials (TIM) and heat sinks can be replaced Simple bonding process: strip-level bonding of printed circuit boards via autoclave or oven curing A high-modulus copper film layer can be used to control warpage - Various high-thermal-conductivity films can be provided according to the type of thermal adhesive. - Fillers such as Ag/Cu, Ni, and Al2O3 can be added to the adhesive layer per customer requirements. - The films can use two types of adhesives: thermosetting and thermoplastic.