Conductive Particles
Semiconductor packaging and testing products.
Specifications
| Code | HCL0303001 |
|---|---|
| Family | Material Products |
Highlights
Excellent plating adhesion No voids or gaps at the plating interface Enables thicker plating deposition.
Semiconductor packaging and testing products.
| Code | HCL0303001 |
|---|---|
| Family | Material Products |
Excellent plating adhesion No voids or gaps at the plating interface Enables thicker plating deposition.